Dyno™ Test Sockets for QFN Devices
With the patent pending Dyno Test Socket, you can get an innovative way to test lead free QFNs and other peripheral devices on 0.5mm and above. Read more...

Package on Package (POP) Test Sockets
PoP test sockets have been providing reliable solutions for both manual and automatic testing of package on package devices. Read more...

BGA Test Sockets
Today BGA devices rule the market. There are plenty of challenges associated with high pin count BGA devices, but your test socket should not be one of them. Read more...

QFN Test Sockets
Because we lead the miniaturization movement, we offer the widest line of pitches available. . Read more...

QFP Test Sockets
Peripheral leaded devices such as SOPs and QFPs introduce their own set of unique challenges into the testing environment. Read more...

Off-Set Kelvin Test Socket
The patent-pending 0.5 pitch Off-Set Kelvin Probe allows those test engineers involved in Kelvin testing to accurately isolate and measure resistance within 1 mΩ, while taking advantage of conventional 0.5mm DUT board designs. Read more...

Multi-Site Test Sockets
Multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. Read more...

Test Socket Lids
For handler setup or hand test, a manual lid is often required as part of the test hardware set. Read more...

Wafer-Level CSP Testing
Synergetix interposers are revolutionizing the testing of wafer-level chip scale packages (WLCSPs) in vertical probing applications. Read more...